The article studies the dependence of the temperature of a heat-loaded element of microelectronics on the parameters of the shape of the heat-removing body. Numerical modeling of the study of the efficiency of the heat-removing surface in terms of reducing the source temperature was carried out in the Ansys Fluent CAD system. The advantage of the heat sink design described in the work is considered to be a fairly high intensity of heat removal from the thermally active region and a small weight, which is provided by the simplicity of the heat sink system and the increased heat transfer rate, which makes it economically advantageous to calculate the use of material and time costs for the manufacture of the product. The increased temperature of electronic equipment elements significantly affects the reliability of their operation. In this paper, the task is to ensure the normal temperature regime of the housing of a heat-loaded microelectronics element using a passive cooling system of a specially designed shape.

Keywords: heat sink, efficiency of the heat-removing structure, thermal resistance, temperature regime, heat transfer, thermal resistance, heat dissipation, heat-loaded element