This work investigated the influence of the type of vertical switching on the level of thermomechanical stresses and temperature deformation in a three-dimensional microassembly. Three microassembly models with the most common types of vertical connections were considered: solder balls in the package holes, metallized holes in the package, and end-switching tracks. For each of the three models, the effect of the sealing compound parameters on the thermomechanical load was additionally investigated.

Keywords: microassembly, packaging, electronic component base, three-dimensional integration, vertical switching, thermomechanical stress, thermomechanical deformation, thermal coefficient of linear expansion, thermomechanical modeling