This paper describes the results of modeling thermal processes and air flows occurring in a universal power source (UPS) with a digital control system for output parameters under given operating conditions. The UIP is intended for scientific research in the field of electrochemical copper deposition in order to form through and via holes in printed circuit boards, three-dimensional microassemblies, metallization of epoxy resins, and organic materials. The article discusses the features of the development of a universal power source, presents the key results of the design and study of the thermodynamic characteristics of a prototype sample.

Keywords: universal power supply, microcontroller, computer aided design, printed circuit board, efficiency factor, computational fluid dynamics, mechanical computer aided design, electrical computer aided design, design rule checking, finite element method

3D integration technologies based on highly integrated substrates and bare chips solve the problem of miniaturization of complex functional devices. However, increasing complexity and decreasing mass-size parameters of products lead to problems of effective heat distribution and dissipation from frameless microcircuits. The article considers features and problems of thermal analysis of 3D computing microsystem based on several modules with bare-metal chips, and also shows the importance of modeling the actual heat generation of programmable logic integrated circuits.

Keywords: microassembly, microsystem, chipless chip, FPGA, thermal analysis, CAD, finite element method, heat transfer simulation, printed circuit board, three-dimensional integration

This work investigated the influence of the type of vertical switching on the level of thermomechanical stresses and temperature deformation in a three-dimensional microassembly. Three microassembly models with the most common types of vertical connections were considered: solder balls in the package holes, metallized holes in the package, and end-switching tracks. For each of the three models, the effect of the sealing compound parameters on the thermomechanical load was additionally investigated.

Keywords: microassembly, packaging, electronic component base, three-dimensional integration, vertical switching, thermomechanical stress, thermomechanical deformation, thermal coefficient of linear expansion, thermomechanical modeling